VIA at ExpoElectronica 2008 in Moscow

Moscow, Russia 15-18, April, 2008 Hall 13, Booth no. F07 (see floorplan)

Join VIA at the ExpoElectronica 2008 at the Crocus Expo in Moscow, Russia, and see how VIA is leading the way in miniaturization and integration on the x86 platform for the embedded market.

VIA will showcase the latest technologies that incorporate the market-leading power efficiency, extended connectivity and rich feature sets that are enabling ever-smaller, ever-cooler embedded systems. VIA will be demonstrating the ultra compact VIA EPIA embedded boards (with VIA C7® solutions), segment boards (VIA NAB 7500 and NAS 7800) focusing on networking and storage industries, and the recently launched VIA ARTiGo Builder Kit. System solutions will be on display at the show including a dual view solution using a Nano-ITX embedded board, the VIA vmpc vm7700 ultra-slim mountable PC system, and the VIA vipro, a touch-panel system — all of which bring rich digital media capabilities to ever smaller form factors.

In addition, VIA will debut the latest generation fully integrated single-chip chipset with the richest digital media feature set, as well as showcase leading embedded components such as the ultra-low power 500MHz VIA Eden™ ULV processor, with maximum power of just 1W, a full complement of companion chips such as the discrete VT1708 HD audio codec, and the cutting edge WLAN add-on cards, all at just one stop for your convenience.

For more information on ExpoElextronica please click here.